Search

Now showing items 1-6 of 6

Robustness guaranteed cost control for discrete-time systems with dynamic quantization

Type: Conference Paper

Author : Wei-Wei Che , Zhi-Yong Mei

Publisher: IEEE

Year: 2014

Investigation of energy storage and open cycle gas turbine for load frequency regulation

Type: Conference Paper

Author : Bo Lian; Dongmin Yu; Cheng Wang; Le Blond, S.; Dunn, R.W.

Publisher: IEEE

Year: 2014

CREMA-D: Crowd-Sourced Emotional Multimodal Actors Dataset

Type: Journal Paper

Author : Houwei Cao; Cooper, David G.; Keutmann, Michael K.; Gur, Ruben C.; Nenkova, Ani; Verma, Rajesh

Publisher: IEEE

Year: 2014

Message from Program Chairs

Type: Conference Paper

Publisher: IEEE

Year: 2014

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling — Correlation of experiments with finite element simulations

Type: Conference Paper

Author : Muller, Matthias; Wohrmann, Markus; Wittler, Olaf; Bader, Volker; Topper, Michael; Lang, Klaus-Dieter

Publisher: IEEE

Year: 2014

Computer aided analysis of projective tests

Type: Conference Paper

Author : Lacrama, D.L.; Pintea, F.A.; Karnyanszky, T.M.; Codat, D.S.

Publisher: IEEE

Year: 2014

Search

Robustness guaranteed cost control for discrete-time systems with dynamic quantization

Investigation of energy storage and open cycle gas turbine for load frequency regulation

CREMA-D: Crowd-Sourced Emotional Multimodal Actors Dataset

Message from Program Chairs

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling — Correlation of experiments with finite element simulations

Computer aided analysis of projective tests

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

Robustness guaranteed cost control for discrete-time systems with dynamic quantization

Investigation of energy storage and open cycle gas turbine for load frequency regulation

CREMA-D: Crowd-Sourced Emotional Multimodal Actors Dataset

Message from Program Chairs

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling &#x2014; Correlation of experiments with finite element simulations

Computer aided analysis of projective tests

Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling — Correlation of experiments with finite element simulations