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Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Type: Journal Paper

Author : Navarro, Luis /A/.; Perpina, Xavier; Godignon, P.; Montserrat, J.; Banu, V.; Vellvehi, Miquel; Jorda, Xavier

Publisher: IEEE

Year: 2014

High Precision Multicolorimetric Pyrometer With a Novel Photoelectric MOSFET

Type: Journal Paper

Author : Sheng Chang; Qijun Huang; Hao Wang; Mincai He; Feng Dai

Publisher: IEEE

Year: 2014

A High Density 250<inline-formula> <img src="/images/tex/21629.gif" alt="^{\\circ}{\\rm C}"> </inline-formula> Junction Temperature SiC Power Module Development

Type: Journal Paper

Author : Puqi Ning; Fei Wang; Di Zhang

Publisher: IEEE

Year: 2014

Core Mode-Cladding Supermode Modal Interferometer and High-Temperature Sensing Application Based on All-Solid Photonic Bandgap Fiber

Type: Journal Paper

Author : Tan, Xiao Liang; Geng, Y.F.; Li, X.J.; Yu, Y.Q.; Deng, Y.L.; Yin, Zheng; Gao, Ran

Publisher: IEEE

Year: 2014

A hot prospect

Type: Journal Paper

Publisher: IET

Year: 2014

A novel architecture of ontology mapping system for Hidden Web Retrieval

Type: Conference Paper

Author : Manvi , Dixit, A. , Bhatia, K.K. , Mishra, R.

Publisher: IEEE

Year: 2014

Heat distribution mathematical model and numerical simulation of an electric oven

Type: Conference Paper

Author : Luo Xuan , Cui Guozhong , Le Fulong

Publisher: IEEE

Year: 2014

GIROFLOW: Openflow virtualized infrastructure management tool

Type: Conference Paper

Author : Do Nascimento Araujo, T.; Moreira Salles, R.

Publisher: IEEE

Year: 2014

Silicon Carbide Integrated Circuits With Stable Operation Over a Wide Temperature Range

Type: Journal Paper

Author : Ghandi, Reza; Cheng-Po Chen; Liang Yin; Xingguang Zhu; Liangchun Yu; Arthur, Stephen; Ahmad, Farhan; Sandvik, Peter

Publisher: IEEE

Year: 2014

A Novel Collision Avoidance Algorithm for IEEE 802.11 Wireless LANs

Type: Conference Paper

Author : Cheng, Hongwei; Yan, Xiao; Lian, Hao; Weng, Lina; Zhang, Qixun; Feng, Zhiyong

Publisher: IEEE

Year: 2014

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Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

High Precision Multicolorimetric Pyrometer With a Novel Photoelectric MOSFET

A High Density 250<inline-formula> <img src="/images/tex/21629.gif" alt="^{\\circ}{\\rm C}"> </inline-formula> Junction Temperature SiC Power Module Development

Core Mode-Cladding Supermode Modal Interferometer and High-Temperature Sensing Application Based on All-Solid Photonic Bandgap Fiber

A hot prospect

A novel architecture of ontology mapping system for Hidden Web Retrieval

Heat distribution mathematical model and numerical simulation of an electric oven

GIROFLOW: Openflow virtualized infrastructure management tool

Silicon Carbide Integrated Circuits With Stable Operation Over a Wide Temperature Range

A Novel Collision Avoidance Algorithm for IEEE 802.11 Wireless LANs

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Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

High Precision Multicolorimetric Pyrometer With a Novel Photoelectric MOSFET

A High Density 250<inline-formula> <img src="/images/tex/21629.gif" alt="^{\\circ}{\\rm C}"> </inline-formula> Junction Temperature SiC Power Module Development

Core Mode-Cladding Supermode Modal Interferometer and High-Temperature Sensing Application Based on All-Solid Photonic Bandgap Fiber

A hot prospect

A novel architecture of ontology mapping system for Hidden Web Retrieval

Heat distribution mathematical model and numerical simulation of an electric oven

GIROFLOW: Openflow virtualized infrastructure management tool

Silicon Carbide Integrated Circuits With Stable Operation Over a Wide Temperature Range

A Novel Collision Avoidance Algorithm for IEEE 802.11 Wireless LANs