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    High resolution and fast throughput-time X-ray computed tomography for semiconductor packaging applications 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Strategic priorities for Electronics, Communications and Photonics (ECP) technologies in Saudi Arabia: Investigation of 3D positioning using ultra-wide band (UWB) technology 

    Type: Conference Paper
    Author : Khalaf-Allah, M.
    Publisher: IEEE
    Year: 2014

    Review of 3-D Endoscopic Surface Imaging Techniques 

    Type: Journal Paper
    Author : Geng, Junping; Xie, Junfeng
    Publisher: IEEE
    Year: 2014

    Parallelized neural networks as a service 

    Type: Conference Paper
    Author : Huqqani, A.A. , Schikuta, E. , Mann, E.
    Publisher: IEEE
    Year: 2014

    Packing and Padding: Coupled Multi-index for Accurate Image Retrieval 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    An area efficient Error correction codes to protect against stuck-at defects and soft errors 

    Type: Conference Paper
    Author : Rajkumar, R.; Ramkumar, N.; Vignesh, M.
    Publisher: IEEE
    Year: 2014

    Optical Imaging With the Use of a Scattering Lens 

    Type: Journal Paper
    Author : Youngwoon Choi; Changhyeong Yoon; Moonseok Kim; Wonjun Choi; Wonshik Choi
    Publisher: IEEE
    Year: 2014

    ECG baseline noise removal techniques using window based FIR filters 

    Type: Conference Paper
    Author : Singh, Tripti; Agarwal, Prabhakar; Pandey, V.K.
    Publisher: IEEE
    Year: 2014

    Time scale analysis and synthesis for Model Predictive Control under stochastic environments 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Automated Model-Based Performance Testing for PaaS Cloud Services 

    Type: Conference Paper
    Author : Junzan Zhou , Bo Zhou , Shanping Li
    Publisher: IEEE
    Year: 2014
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