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Dynamic configuration of batch rekeying interval for secure multicast service

Type: Conference Paper

Publisher: IEEE

Year: 2014

Interplay and influence of thermomechanical stress in copper-filled TSV interposers

Type: Conference Paper

Author : Sheng-Tsai Wu , Cheng-fu Chen , Heng-Chieh Chien

Publisher: IEEE

Year: 2014

Author

Sheng-Tsai Wu , Cheng-fu Chen , Heng-Chieh Chien (1)

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IEEE (2)

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2014 (2)

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dumb charging (2)

electric vehicles (2)

Load modeling (2)

secondary cells (2)

Availability (1)

Batteries (1)

battery powered vehicles (1)

battery storage plants (1)

charging (1)

charging pattern (1)

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Conference Paper (2)

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English (2)

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Metadata Only (2)

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lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th (1)

omputing, Networking and Communications (ICNC), 2014 International Conference on (1)

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