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Separation and classification of underwater acoustic sources

Type: Conference Paper

Author : Rahmati, Mehdi; Pandey, Parul; Pompili, Dario

Publisher: IEEE

Year: 2014

Type: Conference Paper

Publisher: IEEE

Year: 2014

The effects of ultra-smooth surface atomic step morphology on CMP performances of sapphire and SiC wafers

Type: Conference Paper

Author : Zhou, Yan; Pan, Guoshun; Shi, Xiaolei; Zou, Chunli; Gong, Hua; Xu, Li; Luo, Guihai; Zhou, Yan; Pan, Guoshun; Shi, Xiaolei; Zou, Chunli; Gong, Hua; Xu, Li; Luo, Guihai

Publisher: IEEE

Year: 2014

Surface acoustic waves in finite-depth air/silicon phononic crystals

Type: Conference Paper

Author : Jia-Hong Sun; Jyun-Hua Jhou; Yu Yuan-Hai

Publisher: IEEE

Year: 2014

The simulation of rocket assisted torpedo aerial trajectory

Type: Conference Paper

Author : Zhu, Kou; Ning, Fu; Jinzhu, Men

Publisher: IEEE

Year: 2014

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

Type: Journal Paper

Author : Zhenzhen Shen; Kun Fang; Johnson, R. Wayne; Hamilton, Michael C.

Publisher: IEEE

Year: 2014

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Separation and classification of underwater acoustic sources

Table of contents

The effects of ultra-smooth surface atomic step morphology on CMP performances of sapphire and SiC wafers

Surface acoustic waves in finite-depth air/silicon phononic crystals

The simulation of rocket assisted torpedo aerial trajectory

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

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Separation and classification of underwater acoustic sources

Table of contents

The effects of ultra-smooth surface atomic step morphology on CMP performances of sapphire and SiC wafers

Surface acoustic waves in finite-depth air/silicon phononic crystals

The simulation of rocket assisted torpedo aerial trajectory

Characterization of Bi&#x2013;Ag&#x2013;X Solder for High Temperature SiC Die Attach

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach