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    Comparison of high speed bearingless drive topologies with combined windings 

    Type: Conference Paper
    Author : Mitterhofer, H. , Mrak, B. , Gruber, W.
    Publisher: IEEE
    Year: 2014

    Effect of process parameters on structure and piezoelectric properties of AlN and Al<inf>X</inf>Sc<inf>1&#x2212;X</inf>N films deposited by pulsed magnetron sputtering 

    Type: Conference Paper
    Author : Barth, S.; Bartzsch, H.; Gloss, D.; Frach, P.; Zywitzki, O.; Herzog, T.; Walter, S.; Heuer, H.
    Publisher: IEEE
    Year: 2014

    Evaluating the impact of next node selection criteria on Quality of Service dynamic routing 

    Type: Conference Paper
    Author : Spachos, P. , Chatzimisios, P. , Hatzinakos, D.
    Publisher: IEEE
    Year: 2014

    In-situ microwave measurement system for on-board catalyst state monitoring 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Elimination of electrolytic capacitor in AC-DC system of LED driver 

    Type: Conference Paper
    Author : Mustapa, R.F. , Hidayat, N.M. , Tukiman, R.
    Publisher: IEEE
    Year: 2014

    Topology evaluation of slotless bearingless motors with toroidal windings 

    Type: Conference Paper
    Author : Steinert, D. , Nussbaumer, T. , Kolar, J.W.
    Publisher: IEEE
    Year: 2014

    Precise error rate analysis of MIMO system with interference and imperfect channel state information 

    Type: Conference Paper
    Author : Smadi, M.A. , Abu Al-Haija, Q.
    Publisher: IEEE
    Year: 2014

    The Influence of Changes in Customer's Technology Portfolio on Supplier's Organization 

    Type: Conference Paper
    Author : Adrian, L.C. , Morar, L. , Campean, E.
    Publisher: IEEE
    Year: 2014

    Research on branches group based method for adding mutual inductance branches to Y-matrix and Z-matrix 

    Type: Conference Paper
    Author : Ming Chen; Dongyuan Shi; Yinhong Li; Lin Zhu; Huanzhang Liu
    Publisher: IEEE
    Year: 2014

    Implantation and metrology solutions for low energy boron implant on 450mm wafers 

    Type: Conference Paper
    Author : Robbes, A.-S.; Meura, K.-A.B.-T.; Moret, M.-P.; Schuhmacher, M.; Torregrosa, F.; Borvon, G.
    Publisher: IEEE
    Year: 2014
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