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A Test System for Superconducting Joints Based on GM Cryocooler

Type: Journal Paper

Author : Dongsheng Ni; Wenjie Yang; Shaofei Han; Li Zhu; Xiang Zhang; Beimin Wu; Lizhen Ma

Publisher: IEEE

Year: 2014

Real-Time Temperature Estimation for Power MOSFETs Considering Thermal Aging Effects

Type: Journal Paper

Author : Huifeng Chen; Bing Ji; Pickert, Volker; Wenping Cao

Publisher: IEEE

Year: 2014

An Evaluation Method for Radiated Emissions of Components and Modules in Mobile Devices

Type: Journal Paper

Author : Eakhwan Song; Hark-Byeong Park; Hyun Ho Park

Publisher: IEEE

Year: 2014

Testing of the Ceramic Insulation Break for Fusion Device

Type: Journal Paper

Author : Huajun Liu; Qingyun Qu; Qinyan Pan; Yu Wu; Chuanjun Huang; Laifeng Li; Min Yu; Liang Guo

Publisher: IEEE

Year: 2014

Author

Beimin Wu (1)

Bing Ji (1)

Chuanjun Huang (1)

Dongsheng Ni (1)

Eakhwan Song (1)

Hark-Byeong Park (1)

Huajun Liu (1)

Huifeng Chen (1)

Hyun Ho Park (1)

Laifeng Li (1)

Publisher

IEEE (4)

Year

2014 (4)

Keywords

electric resistance (2)

/sub&gt (1)

2&lt (1)

3&lt (1)

active control (1)

Al&lt (1)

alumina (1)

alumina ceramic material (1)

axial insulation breaks (1)

background magnet (1)

Type

Journal Paper (4)

Language (ISO)

English (4)

Content Type

Metadata Only (4)

Publication Title

Applied Superconductivity, IEEE Transactions on (2)

Device and Materials Reliability, IEEE Transactions on (1)

Electromagnetic Compatibility, IEEE Transactions on (1)

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