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Now showing items 1-10 of 26
A Study of Cu/CuMn Barrier for 22-nm Semiconductor Manufacturing
Publisher: IEEE
Year: 2014
Plasma cleaning and its application in microwave module wire bonding technology
Publisher: IEEE
Year: 2014
Time Evolution Degradation Physics in High Power White LEDs Under High Temperature-Humidity Conditions
Publisher: IEEE
Year: 2014
S–Te Interdiffusion within Grains and Grain Boundaries in CdTe Solar Cells
Publisher: IEEE
Year: 2014
Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC Application
Publisher: IEEE
Year: 2014
Proton Radiation-Induced Void Formation in Ni/Au-Gated AlGaN/GaN HEMTs
Publisher: IEEE
Year: 2014