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    High-gain triple-band reconfigurable Vivaldi antenna 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Enterprise application integration as a middleware: Modification in data & process layer 

    Type: Conference Paper
    Author : Al-Ghamdi, Abdullah Al-Malaise , Saleem, Farrukh
    Publisher: IEEE
    Year: 2014

    Active induction of microbubbles in flow at T-form bifurcation through acoustic focal points with phase variation 

    Type: Conference Paper
    Author : Masuda, K.; Hosaka, N.; Koda, R.; Miyazawa, S.; Mochizuki, T.
    Publisher: IEEE
    Year: 2014

    Effect of temperature on space charge trapping and conduction in cross-linked polyethylene 

    Type: Journal Paper
    Author : Lan, Liang; Wu, Junyong; Yin, Yingjie; Li, Xin; Li, Zuyi
    Publisher: IEEE
    Year: 2014

    Simulation on the influence of bipolar charge injection and trapping on surface potential decay of polyethylene 

    Type: Journal Paper
    Author : Min, Dongbo; Li, Sinan
    Publisher: IEEE
    Year: 2014

    Probing contactless injection dielectric charging in RF MEMS capacitive switches 

    Type: Journal Paper
    Author : Michalas, L.; Koutsoureli, M.; Papaioannou, G.
    Publisher: IET
    Year: 2014

    Effect of the Mobility Parameter on the Oscillatory Electroconvection of Dielectric Liquids Subject to Strong Unipolar Charge Injection 

    Type: Journal Paper
    Author : Jian Wu; Traore, Philippe; Louste, Christophe; Dascalescu, Lucian; Fang-Bao Tian; Perez, Alberto T.
    Publisher: IEEE
    Year: 2014

    A fast runtime fault recovery approach for NoC-based MPSoCS for performance constrained applications 

    Type: Conference Paper
    Author : Wachter, Eduardo; Erichsen, Augusto; Juracy, Leonardo; Amory, Alexandre; Moraes, Fernando G.
    Publisher: IEEE
    Year: 2014

    Correction of in phase-quadrature imbalance in the presence of multipath fading 

    Type: Conference Paper
    Author : Haq, K.N. , Kah Seng Chung
    Publisher: IEEE
    Year: 2014

    Cross layer resiliency in real world 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014
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