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    Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations 

    Type: Journal Paper
    Author : Xin Chang; Leung Tsang
    Publisher: IEEE
    Year: 2014

    A 14-bit 500MS/S low power time-interleaved analog-to-digital converter in 0.18-µM CMOS technology with background calibration 

    Type: Conference Paper
    Author : Jie Pu; Xiaofeng Shen; Xingfa Huang; Dongbing Fu; Ruitao Zhang
    Publisher: IEEE
    Year: 2014

    On the mutual information and constellation design criterion of spatial modulation MIMO systems 

    Type: Conference Paper
    Author : Guo, Shuaishuai; Zhang, Haixia; Zhang, Jia; Yuan, Dongfeng
    Publisher: IEEE
    Year: 2014

    Improvement of Unified Boundary Integral Equation Method in Magnetostatic Shielding Analysis 

    Type: Journal Paper
    Author : Ishibashi, Koji; Yoshioka, Takashi; Wakao, Shinji; Takahashi, Y.; Andjelic, Zoran; Fujiwara, Koji
    Publisher: IEEE
    Year: 2014

    Dielectric breakdown model for polymer films 

    Type: Journal Paper
    Author : Lean, Meng H.; Chu, Wei-Ping L.
    Publisher: IEEE
    Year: 2014

    Internal field distributions in multilayer polycarbonate/poly(vinylidene fluoride)-hexafluoropropylene films at onset of breakdown 

    Type: Journal Paper
    Author : Lean, Meng H.; Wolak, M.A.; Mackey, Matthew; Baer, E.
    Publisher: IEEE
    Year: 2014

    Using spatial and spectral information for improving endmember extraction algorithms in hyperspectral remotely sensed images 

    Type: Conference Paper
    Author : Kowkabi, Fatemeh; Ghassemian, Hassan; Keshavarz, Ahmad
    Publisher: IEEE
    Year: 2014

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