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Investigation of filter bank based device-to-device communication integrated into OFDMA cellular system

Type: Conference Paper

Author : Hongnian Xing; Renfors, M.

Publisher: IEEE

Year: 2014

Drop Impact Reliability Analysis of 3-D Chip-on-Chip Packaging: Numerical Modeling and Experimental Validation

Type: Journal Paper

Author : Hsien-Chie Cheng; Hsin-Kai Cheng; Su-Tsai Lu; Jing-Ye Juang; Wen-Hwa Chen

Publisher: IEEE

Year: 2014

Application of Z-numbers in multi-criteria decision making

Type: Conference Paper

Author : Xiao, Zhi-Quan

Publisher: IEEE

Year: 2014

[Blank page]

Type: Conference Paper

Publisher: IEEE

Year: 2014

Author

Hongnian Xing (1)

Hsien-Chie Cheng (1)

Hsin-Kai Cheng (1)

Jing-Ye Juang (1)

Renfors, M. (1)

Su-Tsai Lu (1)

Wen-Hwa Chen (1)

Xiao, Zhi-Quan (1)

Publisher

IEEE (4)

Year

2014 (4)

Keywords

failure analysis (2)

n solders (2)

3D chip-on-chip packaging (1)

Acoustics (1)

advanced ultrafine-pitch 3D integrated ci (1)

ANSYS/LS-DYNA (1)

ARM (1)

Arrays (1)

ball grid arrays (1)

board level test (1)

Type

Conference Paper (3)

Journal Paper (1)

Language (ISO)

English (4)

Content Type

Metadata Only (4)

Publication Title

Device and Materials Reliability, IEEE Transactions on (1)

emiconductor Conference (CAS), 2014 International (1)

ireless Communications Systems (ISWCS), 2014 11th International Symposium on (1)

nformative and Cybernetics for Computational Social Systems (ICCSS), 2014 International Conference o (1)

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