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Evaluating PHEV impacts on domestic distribution grid in terms of power losses and voltage drop
Publisher: IEEE
Year: 2014
Business case for industrial DSM maintenance
Publisher: IEEE
Year: 2014
Low temperature wafer bonding for wafer-level 3D integration
Publisher: IEEE
Year: 2014
Metabolic.Care: A hardware and software platform to monitor and assess diabetic foot condition
Publisher: IEEE
Year: 2014