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Novel metrology and wafer grinder technologies combine for improved capability for TSV structures
Publisher: IEEE
Year: 2014
Source-Observation Weighted Fingerprinting for machine learning based localization
Publisher: IEEE
Year: 2014
Development of a self-aligned etch-back process for selectively doped silicon solar cells
Publisher: IEEE
Year: 2014
Characterization of autoemission reflection at high frequencies for precise radiometer calibration
Publisher: IEEE
Year: 2014
Stability enhancement of fuel cell generation system including DVR
Publisher: IEEE
Year: 2014
Power supply glitch attacks: Design and evaluation of detection circuits
Publisher: IEEE
Year: 2014
Stabilization of transmission hyperbolic equations on Riemannian manifolds
Publisher: IEEE
Year: 2014
Neural networks for supervised pitch tracking in noise
Publisher: IEEE
Year: 2014
Image Information Mining: an Accelerated Bayesian Algorithm for Data Fusion of SAR Big Data
Publisher: IEEE
Year: 2014