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Technological dynamics: An empirical study in mobile telecommunications

Type: Conference Paper

Author : Mei, Hsiao-Chen , Lo, Shihmin , Sher, Peter J.

Publisher: IEEE

Year: 2014

TSV-Aware Interconnect Distribution Models for Prediction of Delay and Power Consumption of 3-D Stacked ICs

Type: Journal Paper

Author : Dae Hyun Kim; Mukhopadhyay, Saibal; Sung Kyu Lim

Publisher: IEEE

Year: 2014

Author

Dae Hyun Kim (1)

Mei, Hsiao-Chen , Lo, Shihmin , Sher, Peter J. (1)

Mukhopadhyay, Saibal (1)

Sung Kyu Lim (1)

Publisher

IEEE (2)

Year

2014 (2)

Keywords

Delays (2)

three-dimensional integrated circuits (2)

Through-silic (2)

3D integrated circuits (1)

3D manufacture variability (1)

3D network-on-chip (1)

3D stacked ICs (1)

adaptive routing (1)

asynchronous communication interfaces (1)

buffer circuits (1)

Type

Conference Paper (1)

Journal Paper (1)

Language (ISO)

English (2)

Content Type

Metadata Only (2)

Publication Title

anagement of Engineering &amp; Technology (PICMET), 2014 Portland International Conference on (1)

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on (1)

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