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Now showing items 1-9 of 9

Spatial statistics of atmospheric signal in repeat-pass InSAR

Type: Conference Paper

Author : Yun-Meng Cao; Zhi-Wei Li; Jian-Chao Wei; Wen-Jun Zhan; Jian-Jun Zhu; Chang-Cheng Wang

Publisher: IEEE

Year: 2014

Thermal survivability characterization of quantum dot multi-junction photovoltaic cells

Type: Conference Paper

Author : Ericksen, P.; Howard, A.; Wilt, D.; Hubbard, S.; Richards, B.

Publisher: IEEE

Year: 2014

An open source Verilog front-end for digital design analysis at word level

Type: Conference Paper

Author : Nguyen, Minh D. , Dang, Quan V. , Nguyen, Lam S.

Publisher: IEEE

Year: 2014

A Delay Test Architecture for TSV With Resistive Open Defects in 3-D Stacked Memories

Type: Journal Paper

Author : Hyungsu Sung; Keewon Cho; Kunsang Yoon; Sungho Kang

Publisher: IEEE

Year: 2014

Increased contact resistance of switching contacts during current carrying

Type: Conference Paper

Author : Weis, Martin , Johler, Werner

Publisher: IEEE

Year: 2014

30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

Type: Journal Paper

Author : Jung, Daniel H.; Heegon Kim; Sukjin Kim; Kim, Jonghoon J.; Bumhee Bae; Jonghoon Kim; Jong-Min Yook; Jun-Chul Kim; Joungho Kim

Publisher: IEEE

Year: 2014

System Level Comparison of 3D Integration Technologies for Future Mobile MPSoC Platform

Type: Journal Paper

Author : Agrawal, Pulin; Milojevic, Dragomir; Raghavan, Praveen; Catthoor, Francky; Van der Perre, Liesbet; Beyne, Eric; Varadarajan, Ravi

Publisher: IEEE

Year: 2014

Motional Resistance Issue of TSV-Based Resonator Device and Its Improvement With a Concave Cu TSV Structural Design

Type: Journal Paper

Author : Jian-Yu Shih; Yen-Chi Chen; Chih-Hung Chiu; Kuan-Neng Chen

Publisher: IEEE

Year: 2014

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

Type: Journal Paper

Author : Athikulwongse, Krit; Ekpanyapong, M.; Sung Kyu Lim

Publisher: IEEE

Year: 2014

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Spatial statistics of atmospheric signal in repeat-pass InSAR

Thermal survivability characterization of quantum dot multi-junction photovoltaic cells

An open source Verilog front-end for digital design analysis at word level

A Delay Test Architecture for TSV With Resistive Open Defects in 3-D Stacked Memories

Increased contact resistance of switching contacts during current carrying

30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

System Level Comparison of 3D Integration Technologies for Future Mobile MPSoC Platform

Motional Resistance Issue of TSV-Based Resonator Device and Its Improvement With a Concave Cu TSV Structural Design

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

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Spatial statistics of atmospheric signal in repeat-pass InSAR

Thermal survivability characterization of quantum dot multi-junction photovoltaic cells

An open source Verilog front-end for digital design analysis at word level

A Delay Test Architecture for TSV With Resistive Open Defects in 3-D Stacked Memories

Increased contact resistance of switching contacts during current carrying

30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

System Level Comparison of 3D Integration Technologies for Future Mobile MPSoC Platform

Motional Resistance Issue of TSV-Based Resonator Device and Its Improvement With a Concave Cu TSV Structural Design

Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement