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Data rate adaptation mechanisms in vehicular networks
Publisher: IEEE
Year: 2014
Full chip impact study of power delivery network designs in monolithic 3D ICs
Publisher: IEEE
Year: 2014
Thermodynamics of the 2-D Ising Model From a Random Path Sampling Method
Publisher: IEEE
Year: 2014
Feasibility of trans-horizon, high-capacity maritime wireless backhaul communication link
Publisher: IEEE
Year: 2014
Evaluation of mounting mechanisms for the installation of lightweight PV systems on commercial rooftops
Publisher: IEEE
Year: 2014
Single- and Two-Phase Thermal Transport in Microchannels With Embedded Staggered Herringbone Mixers
Publisher: IEEE
Year: 2014
3D thermal medical image visualization tool: Integration between MRI and thermographic images
Publisher: IEEE
Year: 2014