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Near- and far-regions of mode splitting in coupled magnetic resonators and use in passive ranging

Type: Conference Paper

Author : Arumugam, D.D.

Publisher: IEEE

Year: 2014

Design, technology, numerical simulation and optimization of building blocks of a micro and nano scale tensile testing platform with focus on a piezoresistive force sensor

Type: Conference Paper

Publisher: IEEE

Year: 2014

Feature extraction, feature selection and machine learning for image classification: A case study

Type: Conference Paper

Author : Popescu, M.C. , Sasu, L.M.

Publisher: IEEE

Year: 2014

Analysis and Design of a High Voltage Integrated Class-B Amplifier for Ultra-Sound Transducers

Type: Journal Paper

Author : Bianchi, D.; Quaglia, Francesco; Mazzanti, Andrea; Svelto, Francesco

Publisher: IEEE

Year: 2014

Demonstration: VR-HYPERSPACE — The innovative use of virtual reality to increase comfort by changing the perception of self and space

Type: Conference Paper

Publisher: IEEE

Year: 2014

Optimal dimensioning of active cell balancing architectures

Type: Conference Paper

Publisher: IEEE

Year: 2014

A noise adaptive method for needle localization in 3D ultrasound images

Type: Conference Paper

Author : Malekian, L. , Talebi, H.A. , Towhidkhah, F.

Publisher: IEEE

Year: 2014

Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module

Type: Journal Paper

Author : Warnock, J.; Yuen Chan; Harrer, Hubert; Carey, Sean; Salem, Gerard; Malone, David; Puri, R.; Zitz, Jeffrey /A/.; Jatkowski, A.; Strevig, G.; Datta, Amitava; Gattiker, Anne; Bansal, Ankur; Mayer, G.; Yiu-Hing Chan; Mayo, M.; Rude, David L.; Sigal, Leonid; Strach, Thomas; Smith, Howard H.; Huajun Wen; Pak-Kin Mak; Shum, C-L Kevin; Plass, Donald; Webb, C.

Publisher: IEEE

Year: 2014

Introduction to the Information Technology in Healthcare Track

Type: Conference Paper

Author : Chismar, William G. , Horan, Thomas A.

Publisher: IEEE

Year: 2014

Keynote summaries

Type: Conference Paper

Publisher: IEEE

Year: 2014

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Near- and far-regions of mode splitting in coupled magnetic resonators and use in passive ranging

Design, technology, numerical simulation and optimization of building blocks of a micro and nano scale tensile testing platform with focus on a piezoresistive force sensor

Feature extraction, feature selection and machine learning for image classification: A case study

Analysis and Design of a High Voltage Integrated Class-B Amplifier for Ultra-Sound Transducers

Demonstration: VR-HYPERSPACE — The innovative use of virtual reality to increase comfort by changing the perception of self and space

Optimal dimensioning of active cell balancing architectures

A noise adaptive method for needle localization in 3D ultrasound images

Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module

Introduction to the Information Technology in Healthcare Track

Keynote summaries

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Near- and far-regions of mode splitting in coupled magnetic resonators and use in passive ranging

Design, technology, numerical simulation and optimization of building blocks of a micro and nano scale tensile testing platform with focus on a piezoresistive force sensor

Feature extraction, feature selection and machine learning for image classification: A case study

Analysis and Design of a High Voltage Integrated Class-B Amplifier for Ultra-Sound Transducers

Demonstration: VR-HYPERSPACE &#x2014; The innovative use of virtual reality to increase comfort by changing the perception of self and space

Optimal dimensioning of active cell balancing architectures

A noise adaptive method for needle localization in 3D ultrasound images

Circuit and Physical Design of the zEnterprise&#x2122; EC12 Microprocessor Chips and Multi-Chip Module

Introduction to the Information Technology in Healthcare Track

Keynote summaries

Demonstration: VR-HYPERSPACE — The innovative use of virtual reality to increase comfort by changing the perception of self and space

Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module