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Image latent semantic analysis based face recognition with ensemble extreme learning machine

Type: Conference Paper

Author : Chao Wang; Jucheng Yang; Yarui Chen; Cao Wu; Yanbin Jiao

Publisher: IEEE

Year: 2014

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

Type: Journal Paper

Author : Zhenzhen Shen; Kun Fang; Johnson, R. Wayne; Hamilton, Michael C.

Publisher: IEEE

Year: 2014

Author

Cao Wu (1)

Chao Wang (1)

Hamilton, Michael C. (1)

Johnson, R. Wayne (1)

Jucheng Yang (1)

Kun Fang (1)

Yanbin Jiao (1)

Yarui Chen (1)

Zhenzhen Shen (1)

Publisher

IEEE (2)

Year

2014 (2)

Keywords

bismuth alloys (2)

/sub&gt (1)

3&lt (1)

ageing (1)

aging (1)

Bi-Ag-X solder paste (1)

CuMo surfaces (1)

DBC (1)

die shear strength (1)

direct bond copper (1)

Type

Conference Paper (1)

Journal Paper (1)

Language (ISO)

English (2)

Content Type

Metadata Only (2)

Publication Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on (1)

omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE (1)

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