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Software-as-a-Service Solution Implementation -- Data Migration Perspective

Type: Conference Paper

Publisher: IEEE

Year: 2014

Testing of the Ceramic Insulation Break for Fusion Device

Type: Journal Paper

Author : Huajun Liu; Qingyun Qu; Qinyan Pan; Yu Wu; Chuanjun Huang; Laifeng Li; Min Yu; Liang Guo

Publisher: IEEE

Year: 2014

Rules of filamentation in tapered diode amplifiers

Type: Conference Paper

Author : Dalin, B.; Pniel, E.; Golod, S.; Goldin, S.Y.; Shekel, E.

Publisher: IEEE

Year: 2014

Author

Chuanjun Huang (1)

Dalin, B. (1)

Goldin, S.Y. (1)

Golod, S. (1)

Huajun Liu (1)

Laifeng Li (1)

Liang Guo (1)

Min Yu (1)

Pniel, E. (1)

Qingyun Qu (1)

Publisher

IEEE (3)

Year

2014 (3)

Keywords

/sub&gt (2)

2&lt (2)

3&lt (2)

O&lt (2)

scanning electron microscopy (2)

SEM (2)

sub&gt (2)

Al&lt (1)

alumina (1)

alumina ceramic material (1)

Type

Conference Paper (2)

Journal Paper (1)

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English (3)

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Metadata Only (3)

Publication Title

Applied Superconductivity, IEEE Transactions on (1)

omputer Software and Applications Conference (COMPSAC), 2014 IEEE 38th Annual (1)

umerical Simulation of Optoelectronic Devices (NUSOD), 2014 14th International Conference on (1)

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