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Asymptotic properties for multipower variation of semimartingales and Gaussian integral processes with jumps

Type: Journal Paper

Author : Liu, Guangying - Wei, Zhengyuan - Zhang, Xinsheng

Publisher: Elsevier Science

Year: 2013

Deployment strategies and performance analysis of Macrocell and Femtocell networks in suburban environment with modern buildings

Type: Conference Paper

Author : Yunas, S.F.; Asp, A.; Niemela, J.; Valkama, M.

Publisher: IEEE

Year: 2014

Maintaining requirements for long-living software systems by incorporating security knowledge

Type: Conference Paper

Publisher: IEEE

Year: 2014

Backstepping control for longitudinal dynamics of hypersonic flight vehicle

Type: Conference Paper

Author : Peng, Wang; Peng, Li; Ming, Lv

Publisher: IEEE

Year: 2014

The Value of Software Documentation Quality

Type: Conference Paper

Author : Plosch, Reinhold; Dautovic, Andreas; Saft, Matthias

Publisher: IEEE

Year: 2014

The interdigital electrode system for detection of monolayer electrical capacity of line C6 glioma cells

Type: Conference Paper

Author : Abramov, I.I.; Grushevskaya, H.V.; Egorov, A.C.; Krylova, N.G.; Lipnevich, I.V.; Orekhovskaya, T.I.; Shulitsky, B.G.; Vasiljev, N.V.; Shcherbakova, I.Y.

Publisher: IEEE

Year: 2014

Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM

Type: Journal Paper

Author : Kang-Wook Lee; Tanikawa, Seiya; Murugesan, Mariappan; Naganuma, H.; Ji-Choel Bea; Fukushima, Tetsuya; Tanaka, T.; Koyanagi, Mitsumasa

Publisher: IEEE

Year: 2014

Passive shared virtual environment for distributed haptic cooperation

Type: Conference Paper

Author : Rakhsha, R. , Constantinescu, D.

Publisher: IEEE

Year: 2014

SSFB: A highly-efficient and scalable simulation reduction technique for SRAM yield analysis

Type: Conference Paper

Author : Rana, M. , Canal, R.

Publisher: IEEE

Year: 2014

Package geometric aware thermal analysis by infrared-radiation thermal images

Type: Conference Paper

Publisher: IEEE

Year: 2014

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Asymptotic properties for multipower variation of semimartingales and Gaussian integral processes with jumps

Deployment strategies and performance analysis of Macrocell and Femtocell networks in suburban environment with modern buildings

Maintaining requirements for long-living software systems by incorporating security knowledge

Backstepping control for longitudinal dynamics of hypersonic flight vehicle

The Value of Software Documentation Quality

The interdigital electrode system for detection of monolayer electrical capacity of line C6 glioma cells

Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM

Passive shared virtual environment for distributed haptic cooperation

SSFB: A highly-efficient and scalable simulation reduction technique for SRAM yield analysis

Package geometric aware thermal analysis by infrared-radiation thermal images

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Asymptotic properties for multipower variation of semimartingales and Gaussian integral processes with jumps

Deployment strategies and performance analysis of Macrocell and Femtocell networks in suburban environment with modern buildings

Maintaining requirements for long-living software systems by incorporating security knowledge

Backstepping control for longitudinal dynamics of hypersonic flight vehicle

The Value of Software Documentation Quality

The interdigital electrode system for detection of monolayer electrical capacity of line C6 glioma cells

Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM

Passive shared virtual environment for distributed haptic cooperation

SSFB: A highly-efficient and scalable simulation reduction technique for SRAM yield analysis

Package geometric aware thermal analysis by infrared-radiation thermal images