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Now showing items 1-10 of 11

Physical and Electrical Characteristics of Silver-Copper Nanopaste as Alternative Die-Attach

Type: Journal Paper

Author : Kim Seah Tan; Kuan Yew Cheong

Publisher: IEEE

Year: 2014

The simulation and analysis on transformer gas Protection Maloperation based on multiple physical fields coupling

Type: Conference Paper

Author : Qiao Wen; Zhang Baohui; Hao Zhiguo; Bo Zhiqian

Publisher: IEEE

Year: 2014

Characterizations of Nanosilver Joints by Rapid Sintering at Low Temperature for Power Electronic Packaging

Type: Journal Paper

Author : Guan-Quan Lu; Wanli Li; Yunhui Mei; Gang Chen; Xin Li; Xu Chen

Publisher: IEEE

Year: 2014

Local subspace video stabilization

Type: Conference Paper

Author : Chengzhou Tang , Ronggang Wang

Publisher: IEEE

Year: 2014

Broadband Method for the Determination of Small Sample's Electrical and Dielectric Properties at High Temperatures

Type: Journal Paper

Author : Kezionis, Algimantas; Kazlauskas, Saulius; Petrulionis, Dalius; Orliukas, Antanas Feliksas

Publisher: IEEE

Year: 2014

The Study of Thermal Resistance Deviation of High-Power LEDs

Type: Journal Paper

Author : Shang-Pin Ying; Han-Kuei Fu; Wei-Feng Tang; Rong-Ci Hong

Publisher: IEEE

Year: 2014

A SiC NMOS Linear Voltage Regulator for High-Temperature Applications

Type: Journal Paper

Author : Valle-Mayorga, Javier /A/.; Rahman, Aminur; Mantooth, Homer Alan

Publisher: IEEE

Year: 2014

Migration of Sintered Nanosilver on Alumina and Aluminum Nitride Substrates at High Temperatures in Dry Air for Electronic Packaging

Type: Journal Paper

Author : Guo-Quan Lu; Wen Yang; Yun-Hui Mei; Xin Li; Gang Chen; Xu Chen

Publisher: IEEE

Year: 2014

High frequency active-clamp buck converter for low power automotive applications

Type: Conference Paper

Author : Nan, Chenhao; Ayyanar, Raja; Xi, Youhao

Publisher: IEEE

Year: 2014

Smart cloud robot using raspberry Pi

Type: Conference Paper

Author : Prabha, S.Sathya; Antony, A.John Paul; Meena, M.Janaki; Pandian, S.R.

Publisher: IEEE

Year: 2014

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Physical and Electrical Characteristics of Silver-Copper Nanopaste as Alternative Die-Attach

The simulation and analysis on transformer gas Protection Maloperation based on multiple physical fields coupling

Characterizations of Nanosilver Joints by Rapid Sintering at Low Temperature for Power Electronic Packaging

Local subspace video stabilization

Broadband Method for the Determination of Small Sample's Electrical and Dielectric Properties at High Temperatures

The Study of Thermal Resistance Deviation of High-Power LEDs

A SiC NMOS Linear Voltage Regulator for High-Temperature Applications

Migration of Sintered Nanosilver on Alumina and Aluminum Nitride Substrates at High Temperatures in Dry Air for Electronic Packaging

High frequency active-clamp buck converter for low power automotive applications

Smart cloud robot using raspberry Pi

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Physical and Electrical Characteristics of Silver-Copper Nanopaste as Alternative Die-Attach

The simulation and analysis on transformer gas Protection Maloperation based on multiple physical fields coupling

Characterizations of Nanosilver Joints by Rapid Sintering at Low Temperature for Power Electronic Packaging

Local subspace video stabilization

Broadband Method for the Determination of Small Sample's Electrical and Dielectric Properties at High Temperatures

The Study of Thermal Resistance Deviation of High-Power LEDs

A SiC NMOS Linear Voltage Regulator for High-Temperature Applications

Migration of Sintered Nanosilver on Alumina and Aluminum Nitride Substrates at High Temperatures in Dry Air for Electronic Packaging

High frequency active-clamp buck converter for low power automotive applications

Smart cloud robot using raspberry Pi