Search
Now showing items 1-10 of 14
Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP
Publisher: IEEE
Year: 2014
Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs
Publisher: IEEE
Year: 2014
Pulse-Vanishing Test for Interposers Wires in 2.5-D IC
Publisher: IEEE
Year: 2014
Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs
Publisher: IEEE
Year: 2014
Power management of shipboard power systems using Interaction Balance Principle
Publisher: IEEE
Year: 2014
Cost-effective geotechnical and sedimentological early site assessment for ocean renewable energies
Publisher: IEEE
Year: 2014
Modeling of the test-fixture / Horizontal Coupling Plane interaction in system-level ESD test setups
Publisher: IEEE
Year: 2014
Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement
Publisher: IEEE
Year: 2014