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Very thin POP and SIP packaging approaches to achieve functionality integration prior to TSV implementation
Publisher: IEEE
Year: 2014
Packaging for SiC power device
Publisher: IEEE
Year: 2014
Contents
Publisher: IEEE
Year: 2014
Soft Consistency Reconstruction: A robust 1-bit compressive sensing algorithm
Publisher: IEEE
Year: 2014
Secrecy in MIMOME wiretap channels: Beamforming with imperfect CSI
Publisher: IEEE
Year: 2014
A survey of RDF store solutions
Publisher: IEEE
Year: 2014
Permission-combination-based scheme for Android mobile malware detection
Publisher: IEEE
Year: 2014