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Evaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing

Type: Journal Paper

Author : Ash, W.M.; Meredith, W.F.; Banks, C.A.; Neskovski, N.N.; Wolff, B.; Monroe, K.; Casasnovas, A.

Publisher: IEEE

Year: 2014

Author index

Type: Conference Paper

Publisher: IEEE

Year: 2014

An overlapping community detection algorithm for opportunistic networks

Type: Conference Paper

Author : Xuebin Ma; Zhenchao Ouyang; Lin Bai; Xin Zhan; Xiangyu Bai

Publisher: IEEE

Year: 2014

Table of contents

Type: Conference Paper

Publisher: IEEE

Year: 2014

Author

Ash, W.M. (1)

Banks, C.A. (1)

Casasnovas, A. (1)

Lin Bai (1)

Meredith, W.F. (1)

Monroe, K. (1)

Neskovski, N.N. (1)

Wolff, B. (1)

Xiangyu Bai (1)

Xin Zhan (1)

Publisher

IEEE (4)

Year

2014 (4)

Keywords

acoustic microscopy (2)

n copper (2)

n Cu (2)

n integrated circuit interconnections (2)

n silicon (2)

C-mode scanning acoustic microscopy (1)

copper (1)

CSAM (1)

Delamination (1)

device reliability testing (1)

Type

Conference Paper (3)

Journal Paper (1)

Language (ISO)

English (4)

Content Type

Metadata Only (4)

Publication Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on (1)

nderwater Communications and Networking (UComms), 2014 (1)

nformative and Cybernetics for Computational Social Systems (ICCSS), 2014 International Conference o (1)

omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE (1)

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