Search

Now showing items 1-10 of 81

Piezoresistive cantilever platform for label-free detection of molecules

Type: Conference Paper

Publisher: IEEE

Year: 2014

Research on dynamic characteristics and countermeasures of AC-DC hybrid power system with large scale HVDC transmission

Type: Conference Paper

Author : Jingbo, He; Mingjie, Li; Jun, Yi; Qing, Chang; Tao, Xu; Zhao, Yu

Publisher: IEEE

Year: 2014

High-Yield Fabrication Process for 3D-Stacked Ultrathin Chip Packages Using Photo-Definable Polyimide and Symmetry in Packages

Type: Journal Paper

Author : Priyabadini, Swarnakamal; Sterken, Tom; Cauwe, Maarten; Van Hoorebeke, Luc; Vanfleteren, Jan

Publisher: IEEE

Year: 2014

A Delay Test Architecture for TSV With Resistive Open Defects in 3-D Stacked Memories

Type: Journal Paper

Author : Hyungsu Sung; Keewon Cho; Kunsang Yoon; Sungho Kang

Publisher: IEEE

Year: 2014

Suppression of Read Disturb Fail Caused by Boosting Hot Carrier Injection Effect for 3-D Stack NAND Flash Memories

Type: Journal Paper

Author : Byeong-In Choe; Jung-Kyu Lee; Byung-Gook Park; Jong-Ho Lee

Publisher: IEEE

Year: 2014

Analysis of the effects of rain on surface wind retrieval from X-band marine radar images

Type: Conference Paper

Author : Liu, Ying; Huang, Weimin; Gill, Eric W.

Publisher: IEEE

Year: 2014

Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

Type: Journal Paper

Author : Liu, Zhe; Swarup, Samarth; Tan, Sheldon X.-D; Chen, Hong-Bin; Wang, Huifang

Publisher: IEEE

Year: 2014

Exploring Silicon Nanophotonics in Throughput Architecture

Type: Journal Paper

Author : Goswami, Nilanjan; Zhongqi Li; Shankar, Raji; Tao Li

Publisher: IEEE

Year: 2014

A 3-D Stacked High-<inline-formula> <img src="/images/tex/18865.gif" alt="Q"> </inline-formula> PI-Based MEMS Inductor for Wireless Power Transmission System in Bio-Implanted Applications

Type: Journal Paper

Author : Xuming Sun; Xuhua Peng; Yang Zheng; Xiuhan Li; Haixia Zhang

Publisher: IEEE

Year: 2014

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer

Type: Conference Paper

Author : Liang Jiang; Yongyong He; Xinchun Lu; Jianbin Luo

Publisher: IEEE

Year: 2014

1
2
3
4
. . .
9

Search

Piezoresistive cantilever platform for label-free detection of molecules

Research on dynamic characteristics and countermeasures of AC-DC hybrid power system with large scale HVDC transmission

High-Yield Fabrication Process for 3D-Stacked Ultrathin Chip Packages Using Photo-Definable Polyimide and Symmetry in Packages

A Delay Test Architecture for TSV With Resistive Open Defects in 3-D Stacked Memories

Suppression of Read Disturb Fail Caused by Boosting Hot Carrier Injection Effect for 3-D Stack NAND Flash Memories

Analysis of the effects of rain on surface wind retrieval from X-band marine radar images

Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

Exploring Silicon Nanophotonics in Throughput Architecture

A 3-D Stacked High-<inline-formula> <img src="/images/tex/18865.gif" alt="Q"> </inline-formula> PI-Based MEMS Inductor for Wireless Power Transmission System in Bio-Implanted Applications

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

Piezoresistive cantilever platform for label-free detection of molecules

Research on dynamic characteristics and countermeasures of AC-DC hybrid power system with large scale HVDC transmission

High-Yield Fabrication Process for 3D-Stacked Ultrathin Chip Packages Using Photo-Definable Polyimide and Symmetry in Packages

A Delay Test Architecture for TSV With Resistive Open Defects in 3-D Stacked Memories

Suppression of Read Disturb Fail Caused by Boosting Hot Carrier Injection Effect for 3-D Stack NAND Flash Memories

Analysis of the effects of rain on surface wind retrieval from X-band marine radar images

Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

Exploring Silicon Nanophotonics in Throughput Architecture

A 3-D Stacked High-<inline-formula> <img src="/images/tex/18865.gif" alt="Q"> </inline-formula> PI-Based MEMS Inductor for Wireless Power Transmission System in Bio-Implanted Applications

Investigation on the galvanic corrosion of copper during chemical mechanical polishing of ruthenium barrier layer