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Maintenance Scheduling of Plasma Etching Chamber in Wafer Fabrication for High-Yield Etching Process

contributor authorLe Minh Duc
contributor authorCher Ming Tan
contributor authorMing Luo
contributor authorLeng, Ian Chan Hian
date accessioned2020-03-12T18:44:57Z
date available2020-03-12T18:44:57Z
date issued2014
identifier issn0894-6507
identifier other6731582.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/968805?show=full
formatgeneral
languageEnglish
publisherIEEE
titleMaintenance Scheduling of Plasma Etching Chamber in Wafer Fabrication for High-Yield Etching Process
typeJournal Paper
contenttypeMetadata Only
identifier padid8002989
subject keywordsbinomial distribution
subject keywordsmaintenance engineering
subject keywordsscheduling
subject keywordssemiconductor technology
subject keywordssputter etching
subject keywordschamber contamination
subject keywordschemical etching process
subject keywordshigh yield etching process
subject keywordsinductively coupled plasma etching chamber
subject keywordsmaintenance scheduling
subject keywordsnegative binomial distribution
subject keywordsparticle count
subject keywordsparticle per wafer pass test
subject keywordswafer fabrication
subject keywordswet clean process
subject keywordsAtmospheric measurements
subject keywordsEtching
subject keywordsMaintenance engineering
subject keywordsParticle measurements
subject keywordsPlasmas
subject keywordsPollution measurement
subject keywordsRadio frequency
subject keywordsIndu
identifier doi10.1109/TSM.2014.2304461
journal titleSemiconductor Manufacturing, IEEE Transactions on
journal volume27
journal issue2
filesize6624320
citations0


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