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Optimized Programs for Shaped Conductive Backfill Material of Grounding Systems Based on the FDTD Simulations

contributor authorRun Xiong
contributor authorBin Chen
contributor authorBi-Hua Zhou
contributor authorCheng Gao
date accessioned2020-03-12T18:42:59Z
date available2020-03-12T18:42:59Z
date issued2014
identifier issn0885-8977
identifier other6725693.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/967909?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleOptimized Programs for Shaped Conductive Backfill Material of Grounding Systems Based on the FDTD Simulations
typeJournal Paper
contenttypeMetadata Only
identifier padid8001954
subject keywordsconductors (electric)
subject keywordsearthing
subject keywordsfinite difference time-domain analysis
subject keywordsFDTD simulations
subject keywordsfinite difference time domain method
subject keywordsgrounding systems
subject keywordsperfect electric conductor wall
subject keywordsperfectly matched layer
subject keywordsshaped conductive backfill material
subject keywordstransient grounding resistance calculation model
subject keywordsComputational modeling
subject keywordsConductivity
subject keywordsFinite difference methods
subject keywordsGrounding
subject keywordsImmune system
subject keywordsMetals
subject keywordsTime-domain analysis
subject keywordsFinite-difference time-domain (FDTD) method
subject keywordsshaped conductive backfill material (SCBM
identifier doi10.1109/TPWRD.2014.2298411
journal titlePower Delivery, IEEE Transactions on
journal volume29
journal issue4
filesize1632000
citations0


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