Study on Transmission Characteristics of Carbon Nanotube Through Silicon Via Interconnect
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سال
: 2014شناسه الکترونیک: 10.1109/LMWC.2014.2361429
کلیدواژه(گان): carbon nanotubes,circuit optimisation,integrated circuit interconnections,integrated circuit modelling,matrix algebra,three-dimensional integrated circuits,transmission lines,ABCD matrix,CNT-TSV,RLCG parameters,SPICE,TL model,TSV transmission characteristics,air gap insulator,carbon nanotube through silicon via interconnect,eye open area,geometrical parameters,insertion loss reduction,material parameters,optimization methodology,resistance inductance capacitance conductance p
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Study on Transmission Characteristics of Carbon Nanotube Through Silicon Via Interconnect
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| contributor author | Libo Qian | |
| contributor author | Zhangming Zhu | |
| contributor author | Yinshui Xia | |
| date accessioned | 2020-03-13T00:26:40Z | |
| date available | 2020-03-13T00:26:40Z | |
| date issued | 2014 | |
| identifier issn | 1531-1309 | |
| identifier other | 6930830.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1146968 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Study on Transmission Characteristics of Carbon Nanotube Through Silicon Via Interconnect | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8329879 | |
| subject keywords | carbon nanotubes | |
| subject keywords | circuit optimisation | |
| subject keywords | integrated circuit interconnections | |
| subject keywords | integrated circuit modelling | |
| subject keywords | matrix algebra | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | transmission lines | |
| subject keywords | ABCD matrix | |
| subject keywords | CNT-TSV | |
| subject keywords | RLCG parameters | |
| subject keywords | SPICE | |
| subject keywords | TL model | |
| subject keywords | TSV transmission characteristics | |
| subject keywords | air gap insulator | |
| subject keywords | carbon nanotube through silicon via interconnect | |
| subject keywords | eye open area | |
| subject keywords | geometrical parameters | |
| subject keywords | insertion loss reduction | |
| subject keywords | material parameters | |
| subject keywords | optimization methodology | |
| subject keywords | resistance inductance capacitance conductance p | |
| identifier doi | 10.1109/LMWC.2014.2361429 | |
| journal title | Microwave and Wireless Components Letters, IEEE | |
| journal volume | 24 | |
| journal issue | 12 | |
| filesize | 620534 | |
| citations | 0 |