| contributor author | Huapeng Zhao | |
| contributor author | En-Xiao Liu | |
| contributor author | Jun Hu | |
| contributor author | Er-Ping Li | |
| date accessioned | 2020-03-13T00:09:25Z | |
| date available | 2020-03-13T00:09:25Z | |
| date issued | 2014 | |
| identifier issn | 2156-3950 | |
| identifier other | 6837426.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1136432?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Fast Contour Integral Equation Method for Wideband Power Integrity Analysis | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8318122 | |
| subject keywords | Hankel matrices | |
| subject keywords | electronics packaging | |
| subject keywords | integral equations | |
| subject keywords | interpolation | |
| subject keywords | Hankel function interpolation | |
| subject keywords | a posteriori approach | |
| subject keywords | a priori approach | |
| subject keywords | acceleration technique | |
| subject keywords | automatic band split algorithm | |
| subject keywords | complex package structures | |
| subject keywords | electronic packages | |
| subject keywords | fast CIE method | |
| subject keywords | fast contour integral equation method | |
| subject keywords | fast matrix filling | |
| subject keywords | fast wideband simulation | |
| subject keywords | power ground planes | |
| subject keywords | system-level power integrity analysis | |
| subject keywords | vector-fitting-based adaptive frequency sampling | |
| subject keywords | wideband power integrity analysis | |
| identifier doi | 10.1109/TCPMT.2014.2327242 | |
| journal title | Components, Packaging and Manufacturing Technology, IEEE Transactions on | |
| journal volume | 4 | |
| journal issue | 8 | |
| filesize | 1626974 | |
| citations | 0 | |
