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Real Field Mission Profile Oriented Design of a SiC-Based PV-Inverter Application

Author:
Sintamarean, Nicolae-Cristian
,
Blaabjerg, Frede
,
Huai Wang
,
Yongheng Yang
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/TIA.2014.2312545
URI: http://libsearch.um.ac.ir:80/fum/handle/fum/1126984
Keyword(s): invertors,solar cells,LCL filter,SiC,converter heatsink thermal impedance,converter safe operating area model,electrothermal model,grid-connected photovoltaic inverter,real field mission profile oriented design,silicon carbide devices,thermal-loading-based classification,three-level bipolar switch neutral point clamped inverter,three-phase grid,Insulated gate bipolar transistors,Junctions,Load modeling,Loading,Performance evaluation,Semiconductor device modeling,Thermal loadin
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    Real Field Mission Profile Oriented Design of a SiC-Based PV-Inverter Application

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contributor authorSintamarean, Nicolae-Cristian
contributor authorBlaabjerg, Frede
contributor authorHuai Wang
contributor authorYongheng Yang
date accessioned2020-03-12T23:53:24Z
date available2020-03-12T23:53:24Z
date issued2014
identifier issn0093-9994
identifier other6775276.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1126984
formatgeneral
languageEnglish
publisherIEEE
titleReal Field Mission Profile Oriented Design of a SiC-Based PV-Inverter Application
typeJournal Paper
contenttypeMetadata Only
identifier padid8306895
subject keywordsinvertors
subject keywordssolar cells
subject keywordsLCL filter
subject keywordsSiC
subject keywordsconverter heatsink thermal impedance
subject keywordsconverter safe operating area model
subject keywordselectrothermal model
subject keywordsgrid-connected photovoltaic inverter
subject keywordsreal field mission profile oriented design
subject keywordssilicon carbide devices
subject keywordsthermal-loading-based classification
subject keywordsthree-level bipolar switch neutral point clamped inverter
subject keywordsthree-phase grid
subject keywordsInsulated gate bipolar transistors
subject keywordsJunctions
subject keywordsLoad modeling
subject keywordsLoading
subject keywordsPerformance evaluation
subject keywordsSemiconductor device modeling
subject keywordsThermal loadin
identifier doi10.1109/TIA.2014.2312545
journal titleIndustry Applications, IEEE Transactions on
journal volume50
journal issue6
filesize2521181
citations0
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