Reconfigurable Computing, 3D Integration, and Recognizing Leaders in our Field
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: 2014شناسه الکترونیک: 10.1109/MM.2014.26
کلیدواژه(گان): 3D silicon integration,B. Ramakrishna Rau award,FPGA,ISCA most influential paper award,Maurice Wilkes award,TSVs,big data,harsh systems,high-speed data center interconnects,mobile systems,reconfigurable computing
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Reconfigurable Computing, 3D Integration, and Recognizing Leaders in our Field
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contributor author | Altman, Erik R. | |
date accessioned | 2020-03-12T23:52:45Z | |
date available | 2020-03-12T23:52:45Z | |
date issued | 2014 | |
identifier issn | 0272-1732 | |
identifier other | 6774352.pdf | |
identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1126598 | |
format | general | |
language | English | |
publisher | IEEE | |
title | Reconfigurable Computing, 3D Integration, and Recognizing Leaders in our Field | |
type | Journal Paper | |
contenttype | Metadata Only | |
identifier padid | 8306468 | |
subject keywords | 3D silicon integration | |
subject keywords | B. Ramakrishna Rau award | |
subject keywords | FPGA | |
subject keywords | ISCA most influential paper award | |
subject keywords | Maurice Wilkes award | |
subject keywords | TSVs | |
subject keywords | big data | |
subject keywords | harsh systems | |
subject keywords | high-speed data center interconnects | |
subject keywords | mobile systems | |
subject keywords | reconfigurable computing | |
identifier doi | 10.1109/MM.2014.26 | |
journal title | Micro, IEEE | |
journal volume | 34 | |
journal issue | 1 | |
filesize | 983659 | |
citations | 0 |