Highly sensitive seesaw capacitive pressure sensor based on SOI wafer

: 2014

یو آر آی: http://libsearch.um.ac.ir:80/fum/handle/fum/1125578

کالکشن :

contributor author	Yang, C.C.
contributor author	Zhao, Qiming
contributor author	Gao, C.C.
contributor author	Liu, G.D.
contributor author	Zhang, Y.X.
contributor author	Cui, W.P.
contributor author	Hao, Y.L.
date accessioned	2020-03-12T23:51:02Z
date available	2020-03-12T23:51:02Z
date issued	2014
identifier issn	0013-5194
identifier other	6759700.pdf
identifier uri	http://libsearch.um.ac.ir:80/fum/handle/fum/1125578
format	general
language	English
publisher	IET
title	Highly sensitive seesaw capacitive pressure sensor based on SOI wafer
type	Journal Paper
contenttype	Metadata Only
identifier padid	8305249
subject keywords	capacitive sensors
subject keywords	deformation
subject keywords	diaphragms
subject keywords	elemental semiconductors
subject keywords	microsensors
subject keywords	pressure sensors
subject keywords	silicon
subject keywords	silicon-on-insulator
subject keywords	MEMS
subject keywords	Si
subject keywords	diaphragm
subject keywords	highly sensitive seesaw capacitive pressure sensor
subject keywords	mechanical deformation
subject keywords	microelectromechanical system
subject keywords	silicon on insulator wafer
identifier doi	10.1049/el.2013.4170
journal title	Electronics Letters
journal volume	50
journal issue	5
filesize	477714
citations	0

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