Software-as-a-Service Solution Implementation -- Data Migration Perspective
Publisher:
Year
: 2014DOI: 10.1109/ICEPT.2014.6922670
Keyword(s): X-ray chemical analysis,carbon steel,finite element analysis,hermetic seals,hybrid integrated circuits,integrated circuit packaging,scanning electron microscopy,thermal conductivity,transient analysis,welding,EDS,HIC system,Kovar alloy,PSW process,SEM,base materials,boundary conditions,cross-sectional microstructure analysis,energy dispersive spectrometer,hermetic packaging structure,hybrid integrated circuit system,low-carbon low-alloy steel,low-carbon steel structure,mic
Collections
:
-
Statistics
Software-as-a-Service Solution Implementation -- Data Migration Perspective
Show full item record
| date accessioned | 2020-03-12T23:34:00Z | |
| date available | 2020-03-12T23:34:00Z | |
| date issued | 2014 | |
| identifier other | 6899274.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1116268 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Software-as-a-Service Solution Implementation -- Data Migration Perspective | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8285842 | |
| subject keywords | X-ray chemical analysis | |
| subject keywords | carbon steel | |
| subject keywords | finite element analysis | |
| subject keywords | hermetic seals | |
| subject keywords | hybrid integrated circuits | |
| subject keywords | integrated circuit packaging | |
| subject keywords | scanning electron microscopy | |
| subject keywords | thermal conductivity | |
| subject keywords | transient analysis | |
| subject keywords | welding | |
| subject keywords | EDS | |
| subject keywords | HIC system | |
| subject keywords | Kovar alloy | |
| subject keywords | PSW process | |
| subject keywords | SEM | |
| subject keywords | base materials | |
| subject keywords | boundary conditions | |
| subject keywords | cross-sectional microstructure analysis | |
| subject keywords | energy dispersive spectrometer | |
| subject keywords | hermetic packaging structure | |
| subject keywords | hybrid integrated circuit system | |
| subject keywords | low-carbon low-alloy steel | |
| subject keywords | low-carbon steel structure | |
| subject keywords | mic | |
| identifier doi | 10.1109/ICEPT.2014.6922670 | |
| journal title | omputer Software and Applications Conference (COMPSAC), 2014 IEEE 38th Annual | |
| filesize | 167723 | |
| citations | 0 | |
| contributor rawauthor | Shabnam, L. , Haque, F. , Bhuiyan, M. , Krishna, A. |