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Software-as-a-Service Solution Implementation -- Data Migration Perspective

Author:
Shabnam, L. , Haque, F. , Bhuiyan, M. , Krishna, A.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ICEPT.2014.6922670
URI: http://libsearch.um.ac.ir:80/fum/handle/fum/1116268
Keyword(s): X-ray chemical analysis,carbon steel,finite element analysis,hermetic seals,hybrid integrated circuits,integrated circuit packaging,scanning electron microscopy,thermal conductivity,transient analysis,welding,EDS,HIC system,Kovar alloy,PSW process,SEM,base materials,boundary conditions,cross-sectional microstructure analysis,energy dispersive spectrometer,hermetic packaging structure,hybrid integrated circuit system,low-carbon low-alloy steel,low-carbon steel structure,mic
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    Software-as-a-Service Solution Implementation -- Data Migration Perspective

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date accessioned2020-03-12T23:34:00Z
date available2020-03-12T23:34:00Z
date issued2014
identifier other6899274.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1116268
formatgeneral
languageEnglish
publisherIEEE
titleSoftware-as-a-Service Solution Implementation -- Data Migration Perspective
typeConference Paper
contenttypeMetadata Only
identifier padid8285842
subject keywordsX-ray chemical analysis
subject keywordscarbon steel
subject keywordsfinite element analysis
subject keywordshermetic seals
subject keywordshybrid integrated circuits
subject keywordsintegrated circuit packaging
subject keywordsscanning electron microscopy
subject keywordsthermal conductivity
subject keywordstransient analysis
subject keywordswelding
subject keywordsEDS
subject keywordsHIC system
subject keywordsKovar alloy
subject keywordsPSW process
subject keywordsSEM
subject keywordsbase materials
subject keywordsboundary conditions
subject keywordscross-sectional microstructure analysis
subject keywordsenergy dispersive spectrometer
subject keywordshermetic packaging structure
subject keywordshybrid integrated circuit system
subject keywordslow-carbon low-alloy steel
subject keywordslow-carbon steel structure
subject keywordsmic
identifier doi10.1109/ICEPT.2014.6922670
journal titleomputer Software and Applications Conference (COMPSAC), 2014 IEEE 38th Annual
filesize167723
citations0
contributor rawauthorShabnam, L. , Haque, F. , Bhuiyan, M. , Krishna, A.
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