Material characterization of a novel lead-free solder material — SACQ
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سال
: 2014شناسه الکترونیک: 10.1109/GlobalSIP.2014.7032133
کلیدواژه(گان): Big data,Context,Data compression,Decoding,Encoding,Redundancy,Throughput,big data,distributed computing,minimum description length,parallel algorithms,redundancy,two-pass code,universal data compression
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Material characterization of a novel lead-free solder material — SACQ
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date accessioned | 2020-03-12T23:32:09Z | |
date available | 2020-03-12T23:32:09Z | |
date issued | 2014 | |
identifier other | 6897333.pdf | |
identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1115153 | |
format | general | |
language | English | |
publisher | IEEE | |
title | Material characterization of a novel lead-free solder material — SACQ | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8284558 | |
subject keywords | Big data | |
subject keywords | Context | |
subject keywords | Data compression | |
subject keywords | Decoding | |
subject keywords | Encoding | |
subject keywords | Redundancy | |
subject keywords | Throughput | |
subject keywords | big data | |
subject keywords | distributed computing | |
subject keywords | minimum description length | |
subject keywords | parallel algorithms | |
subject keywords | redundancy | |
subject keywords | two-pass code | |
subject keywords | universal data compression | |
identifier doi | 10.1109/GlobalSIP.2014.7032133 | |
journal title | lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th | |
filesize | 2664101 | |
citations | 0 | |
contributor rawauthor | Tak-Sang Yeung , Sze, H. , Tan, K. , Sandhu, J. , Chong-Wei Neo , Law, E. |