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Fabrication and simulation of silicon structures with high aspect ratio for field emission devices

Author:
Lawrowski, R. , Langer, C. , Prommesberger, C. , Dams, F. , Bachmann, M. , Schreiner, R.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/WCNC.2014.6952996
URI: http://libsearch.um.ac.ir:80/fum/handle/fum/1113062
Keyword(s): Acoustic sensors,Acoustics,Direction-of-arrival estimation,Hardware,Microphones,Nickel,Peer-to-peer computing
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    Fabrication and simulation of silicon structures with high aspect ratio for field emission devices

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date accessioned2020-03-12T23:28:36Z
date available2020-03-12T23:28:36Z
date issued2014
identifier other6894805.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1113062
formatgeneral
languageEnglish
publisherIEEE
titleFabrication and simulation of silicon structures with high aspect ratio for field emission devices
typeConference Paper
contenttypeMetadata Only
identifier padid8282076
subject keywordsAcoustic sensors
subject keywordsAcoustics
subject keywordsDirection-of-arrival estimation
subject keywordsHardware
subject keywordsMicrophones
subject keywordsNickel
subject keywordsPeer-to-peer computing
identifier doi10.1109/WCNC.2014.6952996
journal titleacuum Nanoelectronics Conference (IVNC), 2014 27th International
filesize777870
citations0
contributor rawauthorLawrowski, R. , Langer, C. , Prommesberger, C. , Dams, F. , Bachmann, M. , Schreiner, R.
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