Domain-based design platform of interacting RNAs: A promising tool in synthetic biology
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: 2014DOI: 10.1109/ECTC.2014.6897583
Keyword(s): electronic engineering computing,n flip-chip devices,n moulding,n resins,n voids (solid),n CAE technique,n air void generation,n bump shape,n computer-aided engineering technique,n flip chip connection process,n flip chip packaging,n liquid epoxy resin,n molding phenomena,n residual position prediction,n residual voids,n resin flow,n resin properties,n thermo-compression molding process,n Analytical models,n Heating,n Resins,n Shape
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Domain-based design platform of interacting RNAs: A promising tool in synthetic biology
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| contributor author | Thaiprasit, J. | |
| contributor author | Kaewkamnerdpong, B. | |
| contributor author | Waraho, D. | |
| contributor author | Cheevadhanarak, S. | |
| contributor author | Meechai, A. | |
| date accessioned | 2020-03-12T22:38:16Z | |
| date available | 2020-03-12T22:38:16Z | |
| date issued | 2014 | |
| identifier other | 7017438.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1089542 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Domain-based design platform of interacting RNAs: A promising tool in synthetic biology | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227775 | |
| subject keywords | electronic engineering computing | |
| subject keywords | n flip-chip devices | |
| subject keywords | n moulding | |
| subject keywords | n resins | |
| subject keywords | n voids (solid) | |
| subject keywords | n CAE technique | |
| subject keywords | n air void generation | |
| subject keywords | n bump shape | |
| subject keywords | n computer-aided engineering technique | |
| subject keywords | n flip chip connection process | |
| subject keywords | n flip chip packaging | |
| subject keywords | n liquid epoxy resin | |
| subject keywords | n molding phenomena | |
| subject keywords | n residual position prediction | |
| subject keywords | n residual voids | |
| subject keywords | n resin flow | |
| subject keywords | n resin properties | |
| subject keywords | n thermo-compression molding process | |
| subject keywords | n Analytical models | |
| subject keywords | n Heating | |
| subject keywords | n Resins | |
| subject keywords | n Shape | |
| identifier doi | 10.1109/ECTC.2014.6897583 | |
| journal title | iomedical Engineering International Conference (BMEiCON), 2014 7th | |
| filesize | 411520 | |
| citations | 0 |