Control system design for external continuous flow centrifugal VAD
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سال
: 2014شناسه الکترونیک: 10.1109/ECTC.2014.6897573
کلیدواژه(گان): ageing,n aluminium,n copper,n corrosion resistance,n failure analysis,n integrated circuit interconnections,n lead bonding,n semiconductor device packaging,n semiconductor device reliability,n Cu-Al,n IMC thickness,n Levenberg-Marquardt algorithm,n Parr Bomb technique,n X-ray microCT,n accelerated testing,n copper wire bonding technology,n electrical resistance,n failure assessment,n failure mechanism,n first-level interconnect,n gold w
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آمار بازدید
Control system design for external continuous flow centrifugal VAD
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| contributor author | Rungsirikunnan, C. | |
| contributor author | Chusri, Y. | |
| contributor author | Naiyanetr, P. | |
| date accessioned | 2020-03-12T22:38:14Z | |
| date available | 2020-03-12T22:38:14Z | |
| date issued | 2014 | |
| identifier other | 7017427.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1089531 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Control system design for external continuous flow centrifugal VAD | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227758 | |
| subject keywords | ageing | |
| subject keywords | n aluminium | |
| subject keywords | n copper | |
| subject keywords | n corrosion resistance | |
| subject keywords | n failure analysis | |
| subject keywords | n integrated circuit interconnections | |
| subject keywords | n lead bonding | |
| subject keywords | n semiconductor device packaging | |
| subject keywords | n semiconductor device reliability | |
| subject keywords | n Cu-Al | |
| subject keywords | n IMC thickness | |
| subject keywords | n Levenberg-Marquardt algorithm | |
| subject keywords | n Parr Bomb technique | |
| subject keywords | n X-ray microCT | |
| subject keywords | n accelerated testing | |
| subject keywords | n copper wire bonding technology | |
| subject keywords | n electrical resistance | |
| subject keywords | n failure assessment | |
| subject keywords | n failure mechanism | |
| subject keywords | n first-level interconnect | |
| subject keywords | n gold w | |
| identifier doi | 10.1109/ECTC.2014.6897573 | |
| journal title | iomedical Engineering International Conference (BMEiCON), 2014 7th | |
| filesize | 1455483 | |
| citations | 0 |