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contributor authorTurjo, F.O.
contributor authorIslam, M.A.
contributor authorBhuiyan, S.U.
contributor authorIslam, T.
contributor authorPathik, B.B.
date accessioned2020-03-12T22:38:13Z
date available2020-03-12T22:38:13Z
date issued2014
identifier other7017415.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1089520?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleDesign, simulation and implementation of a novel online patients' health checking method for physicians
typeConference Paper
contenttypeMetadata Only
identifier padid8227746
subject keywordscopper
subject keywordsn elemental semiconductors
subject keywordsn filling
subject keywordsn semiconductor device reliability
subject keywordsn semiconductor technology
subject keywordsn silicon
subject keywordsn three-dimensional integrated circuits
subject keywordsn wafer level packaging
subject keywordsn wafer-scale integration
subject keywordsn Cu
subject keywordsn Si
subject keywordsn blind vias
subject keywordsn bottom-up TSV filling
subject keywordsn bumpless TSV integration approach
subject keywordsn carrier wafer
subject keywordsn copper RDL
subject keywordsn one-time bottom-up copper filling
subject keywordsn prepatterned BCB
subject keywordsn release layer
subject keywordsn resistance 7.6 mohm
subject keywordsn seed layer
subject keywordsn silicon waf
identifier doi10.1109/ECTC.2014.6897561
journal titleiomedical Engineering International Conference (BMEiCON), 2014 7th
filesize1583658
citations0


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