date accessioned | 2020-03-12T22:37:37Z | |
date available | 2020-03-12T22:37:37Z | |
date issued | 2014 | |
identifier other | 7017114.pdf | |
identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1089196?show=full | |
format | general | |
language | English | |
publisher | IEEE | |
title | Author index | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8227367 | |
subject keywords | etching | |
subject keywords | n glass | |
subject keywords | n inductors | |
subject keywords | n photolithography | |
subject keywords | n Q factor | |
subject keywords | n TGV interposer technology | |
subject keywords | n UV-exposure times | |
subject keywords | n accuracy via-holes | |
subject keywords | n chemical wet etching | |
subject keywords | n fine via-holes | |
subject keywords | n frequency 0.9 GHz | |
subject keywords | n frequency 2 GHz | |
subject keywords | n high performance IPD | |
subject keywords | n high-Q spiral inductors | |
subject keywords | n high-aspect-ratio metal | |
subject keywords | n integrated passive devices | |
subject keywords | n photolithography | |
subject keywords | n photosensitive glass | |
subject keywords | n through glass via | |
subject keywords | n Etching | |
subject keywords | n Glass | |
subject keywords | n Inductors | |
subject keywords | n Q-factor | |
subject keywords | n Radio frequency | |
identifier doi | 10.1109/ECTC.2014.6897264 | |
journal title | erformance Computing and Communications Conference (IPCCC), 2014 IEEE International | |
filesize | 358705 | |
citations | 0 | |