contributor author | Furnell, R. | |
contributor author | Scott, P. | |
date accessioned | 2020-03-12T22:26:15Z | |
date available | 2020-03-12T22:26:15Z | |
date issued | 2014 | |
identifier other | 7009031.pdf | |
identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1082992?show=full | |
format | general | |
language | English | |
publisher | IEEE | |
title | Can social networking improve project management? An exploratory study of UK professional experience | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8219635 | |
subject keywords | conductive adhesives | |
subject keywords | n heat sinks | |
subject keywords | n integrated circuit packaging | |
subject keywords | n mechanical strength | |
subject keywords | n nanostructured materials | |
subject keywords | n silver alloys | |
subject keywords | n sintering | |
subject keywords | n thermal resistance | |
subject keywords | n Ag | |
subject keywords | n TIMs | |
subject keywords | n heat sink | |
subject keywords | n heat source | |
subject keywords | n integrated circuits | |
subject keywords | n joints mechanical strength | |
subject keywords | n microelectronic packaging | |
subject keywords | n nano-silver paste sintering phenomena | |
subject keywords | n silicon chip fixing | |
subject keywords | n thermal interface materials | |
subject keywords | n thermal properties | |
subject keywords | n thermal resistance | |
subject keywords | n thermally conductive adh | |
identifier doi | 10.1109/ISSE.2014.6887626 | |
journal title | nformation Society (i-Society), 2014 International Conference on | |
filesize | 233681 | |
citations | 0 | |