High precision FPGA implementation of neural network activation functions
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: 2014شناسه الکترونیک: 10.1109/ISSE.2014.6887582
کلیدواژه(گان): bismuth alloys,n copper alloys,n printed circuits,n reflow soldering,n shear strength,n tin alloys,n BiSnAg,n Cu<,sub>,6<,/sub>,Sn<,sub>,5<,/sub>,n IMC,n PCB,n SnBi-Cu,n chip resistors,n confocal laser scanning microscope,n intermetallic compound,n mechanical strength,n printed circuit boards,n reflow soldering profiles,n shear strength test,n solder pads,n Heating,n Intermetallic,n Joints,n Soldering,n Tempera
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High precision FPGA implementation of neural network activation functions
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| contributor author | Ortega-Zamorano, Francisco | |
| contributor author | Jerez, Jose M. | |
| contributor author | Juarez, Gustavo | |
| contributor author | Perez, Jorge O. | |
| contributor author | Franco, Leonardo | |
| date accessioned | 2020-03-12T22:26:10Z | |
| date available | 2020-03-12T22:26:10Z | |
| date issued | 2014 | |
| identifier other | 7008986.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1082946 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | High precision FPGA implementation of neural network activation functions | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8219584 | |
| subject keywords | bismuth alloys | |
| subject keywords | n copper alloys | |
| subject keywords | n printed circuits | |
| subject keywords | n reflow soldering | |
| subject keywords | n shear strength | |
| subject keywords | n tin alloys | |
| subject keywords | n BiSnAg | |
| subject keywords | n Cu< | |
| subject keywords | sub> | |
| subject keywords | 6< | |
| subject keywords | /sub> | |
| subject keywords | Sn< | |
| subject keywords | sub> | |
| subject keywords | 5< | |
| subject keywords | /sub> | |
| subject keywords | n IMC | |
| subject keywords | n PCB | |
| subject keywords | n SnBi-Cu | |
| subject keywords | n chip resistors | |
| subject keywords | n confocal laser scanning microscope | |
| subject keywords | n intermetallic compound | |
| subject keywords | n mechanical strength | |
| subject keywords | n printed circuit boards | |
| subject keywords | n reflow soldering profiles | |
| subject keywords | n shear strength test | |
| subject keywords | n solder pads | |
| subject keywords | n Heating | |
| subject keywords | n Intermetallic | |
| subject keywords | n Joints | |
| subject keywords | n Soldering | |
| subject keywords | n Tempera | |
| identifier doi | 10.1109/ISSE.2014.6887582 | |
| journal title | ntelligent Embedded Systems (IES), 2014 IEEE Symposium on | |
| filesize | 1417329 | |
| citations | 0 |