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A new signal combination for 3-channel duty-cycle division multiplexing technique

contributor authorSeyedzadeh, Saleh
contributor authorMahdiraji, Ghafour Amouzad
date accessioned2020-03-12T22:18:20Z
date available2020-03-12T22:18:20Z
date issued2014
identifier other7002299.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1078399?show=full
formatgeneral
languageEnglish
publisherIEEE
titleA new signal combination for 3-channel duty-cycle division multiplexing technique
typeConference Paper
contenttypeMetadata Only
identifier padid8214692
subject keywordsCMOS integrated circuits
subject keywordsn Ge-Si alloys
subject keywordsn III-V semiconductors
subject keywordsn MOSFET
subject keywordsn gallium arsenide
subject keywordsn indium compounds
subject keywordsn invertors
subject keywordsn nanoelectronics
subject keywordsn wafer bonding
subject keywordsn CMOS inverters
subject keywordsn InGaAs
subject keywordsn InGaAs n-FETs
subject keywordsn SiGe
subject keywordsn co-integrating high mobility channels
subject keywordsn co-planar nanoscaled SiGe p-FETs
subject keywordsn direct wafer bonding
subject keywordsn hybrid substrates
subject keywordsn n-channel field effect transistors
subject keywordsn p-channel field effect transistors
subject keywordsn stacked ultrathin high-mobility layers
identifier doi10.1109/ICIPRM.2014.6880563
journal titlehotonics (ICP), 2014 IEEE 5th International Conference on
filesize2801450
citations0


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