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Understanding delamination for fast development of reliable packages for automotive applications. A consideration of adhesion by interlocking and anchoring

contributor authorPufall, R.
contributor authorGoroll, M.
contributor authorReuther, G.M.
date accessioned2020-03-12T21:52:38Z
date available2020-03-12T21:52:38Z
date issued2014
identifier other6962790.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1063647?show=full
formatgeneral
languageEnglish
publisherIEEE
titleUnderstanding delamination for fast development of reliable packages for automotive applications. A consideration of adhesion by interlocking and anchoring
typeConference Paper
contenttypeMetadata Only
identifier padid8196029
subject keywordsQ-factor
subject keywordsn error statistics
subject keywordsn intensity modulation
subject keywordsn wavelength division multiplexing
subject keywordsn BER values
subject keywordsn DWDM system
subject keywordsn FSO communication system
subject keywordsn FSO transmission channel
subject keywordsn Mach-Zehnder modulator
subject keywordsn Q factor
subject keywordsn bit error rate
subject keywordsn dense wavelength division multiplexing
subject keywordsn electrical signal modulation
subject keywordsn free space optical transmission system
subject keywordsn optical signal
subject keywordsn power meter
subject keywordsn Adaptive optics
subject keywordsn Bit error rate
subject keywordsn Optical fibers
subject keywordsn Optical pulses
subject keywordsn Optic
identifier doi10.1109/IndiaCom.2014.6828083
journal titlelectronics System-Integration Technology Conference (ESTC), 2014
filesize1335142
citations0


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