Influencing factors on motor vibration & rotor critical speed in design, test and field applications
Publisher:
Year
: 2014DOI: 10.1109/ICEP.2014.6826753
Keyword(s): copper,n electromigration,n integrated circuit bonding,n integrated circuit interconnections,n integrated circuit packaging,n integrated circuit reliability,n integrated circuit testing,n lead bonding,n nickel,n solders,n three-dimensional integrated circuits,n tin,n Cu-Ni-Sn-Ni-Cu,n Cu-Sn-Cu,n Cu-Sn-Ni-Cu,n UBM structure,n bump height,n capillary-type underfill,n chip-to-chip test vehicle,n electromigration test,n fluxless thermocompre
Collections
:
-
Statistics
Influencing factors on motor vibration & rotor critical speed in design, test and field applications
Show full item record
| contributor author | Mistry, Raj | |
| contributor author | Finley, Bill | |
| contributor author | Kreitzer, Scott | |
| contributor author | Queen, Ryan | |
| date accessioned | 2020-03-12T21:51:44Z | |
| date available | 2020-03-12T21:51:44Z | |
| date issued | 2014 | |
| identifier other | 6961887.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1063138?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Influencing factors on motor vibration & rotor critical speed in design, test and field applications | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8195241 | |
| subject keywords | copper | |
| subject keywords | n electromigration | |
| subject keywords | n integrated circuit bonding | |
| subject keywords | n integrated circuit interconnections | |
| subject keywords | n integrated circuit packaging | |
| subject keywords | n integrated circuit reliability | |
| subject keywords | n integrated circuit testing | |
| subject keywords | n lead bonding | |
| subject keywords | n nickel | |
| subject keywords | n solders | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n tin | |
| subject keywords | n Cu-Ni-Sn-Ni-Cu | |
| subject keywords | n Cu-Sn-Cu | |
| subject keywords | n Cu-Sn-Ni-Cu | |
| subject keywords | n UBM structure | |
| subject keywords | n bump height | |
| subject keywords | n capillary-type underfill | |
| subject keywords | n chip-to-chip test vehicle | |
| subject keywords | n electromigration test | |
| subject keywords | n fluxless thermocompre | |
| identifier doi | 10.1109/ICEP.2014.6826753 | |
| journal title | etroleum and Chemical Industry Technical Conference (PCIC), 2014 IEEE | |
| filesize | 919989 | |
| citations | 0 |