Single Sensor Blind Time-Frequency Activity Estimation of a Mixture of Radio Signals via CP Tensor Decomposition
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سال
: 2014شناسه الکترونیک: 10.1109/EuroSimE.2014.6813820
کلیدواژه(گان): adhesive bonding,n creep testing,n fatigue,n reliability,n silver,n tensile testing,n thermal expansion,n ABAQUS 20 model,n Ag,n CTE,n bi-material bonding,n coefficient of thermal expansion,n creep tests,n die attachment reliability,n electronic assembly,n epoxy based adhesives,n fatigue life,n glass-amorphous behaviour,n isotropic conductive adhesive,n life prediction,n microelectronic components,n on-ground test temperatures,n s
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آمار بازدید
Single Sensor Blind Time-Frequency Activity Estimation of a Mixture of Radio Signals via CP Tensor Decomposition
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| contributor author | Mueller-Smith, Christopher | |
| contributor author | Spasojevic, Predrag | |
| date accessioned | 2020-03-12T21:45:09Z | |
| date available | 2020-03-12T21:45:09Z | |
| date issued | 2014 | |
| identifier other | 6956830.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1059172 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Single Sensor Blind Time-Frequency Activity Estimation of a Mixture of Radio Signals via CP Tensor Decomposition | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8190692 | |
| subject keywords | adhesive bonding | |
| subject keywords | n creep testing | |
| subject keywords | n fatigue | |
| subject keywords | n reliability | |
| subject keywords | n silver | |
| subject keywords | n tensile testing | |
| subject keywords | n thermal expansion | |
| subject keywords | n ABAQUS 20 model | |
| subject keywords | n Ag | |
| subject keywords | n CTE | |
| subject keywords | n bi-material bonding | |
| subject keywords | n coefficient of thermal expansion | |
| subject keywords | n creep tests | |
| subject keywords | n die attachment reliability | |
| subject keywords | n electronic assembly | |
| subject keywords | n epoxy based adhesives | |
| subject keywords | n fatigue life | |
| subject keywords | n glass-amorphous behaviour | |
| subject keywords | n isotropic conductive adhesive | |
| subject keywords | n life prediction | |
| subject keywords | n microelectronic components | |
| subject keywords | n on-ground test temperatures | |
| subject keywords | n s | |
| identifier doi | 10.1109/EuroSimE.2014.6813820 | |
| journal title | ilitary Communications Conference (MILCOM), 2014 IEEE | |
| filesize | 261923 | |
| citations | 0 |