Adaptive Transmit and Receive Beamforming Based on Subspace Projection for Anti-jamming
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Year
: 2014DOI: 10.1109/EuroSimE.2014.6813781
Keyword(s): delamination,n electronics packaging,n finite element analysis,n materials testing,n moulding,n Cu,n EMC,n Keyence optical system,n cohesive zone modeling,n copper interfaces,n delamination tests,n epoxy molding compound,n finite element model,n four point bending test,n interface delamination,n interface properties,n interface toughness,n microelectronic packaging industry,n moisture effect,n numerical simulations,n temperature 293 K t
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Adaptive Transmit and Receive Beamforming Based on Subspace Projection for Anti-jamming
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| contributor author | Zhang, Shengjun | |
| contributor author | Huang, Kaizhi | |
| contributor author | Li, Xiangyu | |
| date accessioned | 2020-03-12T21:45:05Z | |
| date available | 2020-03-12T21:45:05Z | |
| date issued | 2014 | |
| identifier other | 6956791.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1059131 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Adaptive Transmit and Receive Beamforming Based on Subspace Projection for Anti-jamming | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8190647 | |
| subject keywords | delamination | |
| subject keywords | n electronics packaging | |
| subject keywords | n finite element analysis | |
| subject keywords | n materials testing | |
| subject keywords | n moulding | |
| subject keywords | n Cu | |
| subject keywords | n EMC | |
| subject keywords | n Keyence optical system | |
| subject keywords | n cohesive zone modeling | |
| subject keywords | n copper interfaces | |
| subject keywords | n delamination tests | |
| subject keywords | n epoxy molding compound | |
| subject keywords | n finite element model | |
| subject keywords | n four point bending test | |
| subject keywords | n interface delamination | |
| subject keywords | n interface properties | |
| subject keywords | n interface toughness | |
| subject keywords | n microelectronic packaging industry | |
| subject keywords | n moisture effect | |
| subject keywords | n numerical simulations | |
| subject keywords | n temperature 293 K t | |
| identifier doi | 10.1109/EuroSimE.2014.6813781 | |
| journal title | ilitary Communications Conference (MILCOM), 2014 IEEE | |
| filesize | 704940 | |
| citations | 0 |