Analysis of laser typing spots at gold-plated kovar alloy cavity
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سال
: 2014شناسه الکترونیک: 10.1109/ICEPT.2014.6922738
کلیدواژه(گان): bubbles,ceramics,coatings,electronics packaging,gels,hydrostatics,lead bonding,microsensors,pressure sensors,MEMS pressure sensor,bubble inflation,bubbles effect,ceramic substrate,chip surface protection,coating gel,cured gel,curing processes,dispensing gel process,dispensing process parameters,elevated air pressure,hydrostatic fluid-element based 2D models,low-pressure sensor module production,mechanical behavior,packaged modules,sensing membrane,sensor chip,silicon ch
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Analysis of laser typing spots at gold-plated kovar alloy cavity
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| contributor author | Yuwei Zheng | |
| contributor author | Shengxiang Bao | |
| contributor author | Zhenzhen Rao | |
| contributor author | Chengshi Zhang | |
| contributor author | Yao Yan | |
| date accessioned | 2020-03-12T21:03:33Z | |
| date available | 2020-03-12T21:03:33Z | |
| date issued | 2014 | |
| identifier other | 6922814.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1035507 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Analysis of laser typing spots at gold-plated kovar alloy cavity | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8161573 | |
| subject keywords | bubbles | |
| subject keywords | ceramics | |
| subject keywords | coatings | |
| subject keywords | electronics packaging | |
| subject keywords | gels | |
| subject keywords | hydrostatics | |
| subject keywords | lead bonding | |
| subject keywords | microsensors | |
| subject keywords | pressure sensors | |
| subject keywords | MEMS pressure sensor | |
| subject keywords | bubble inflation | |
| subject keywords | bubbles effect | |
| subject keywords | ceramic substrate | |
| subject keywords | chip surface protection | |
| subject keywords | coating gel | |
| subject keywords | cured gel | |
| subject keywords | curing processes | |
| subject keywords | dispensing gel process | |
| subject keywords | dispensing process parameters | |
| subject keywords | elevated air pressure | |
| subject keywords | hydrostatic fluid-element based 2D models | |
| subject keywords | low-pressure sensor module production | |
| subject keywords | mechanical behavior | |
| subject keywords | packaged modules | |
| subject keywords | sensing membrane | |
| subject keywords | sensor chip | |
| subject keywords | silicon ch | |
| identifier doi | 10.1109/ICEPT.2014.6922738 | |
| journal title | lectronic Packaging Technology (ICEPT), 2014 15th International Conference on | |
| filesize | 521294 | |
| citations | 0 |