Numerical analysis on MUF process for flip chip packaging
| contributor author | Xiyun Cheng | |
| contributor author | Qian Wang | |
| contributor author | Lin Tan | |
| contributor author | Guanhua Li | |
| contributor author | Yu Chen | |
| contributor author | Jian Cai | |
| date accessioned | 2020-03-12T21:03:27Z | |
| date available | 2020-03-12T21:03:27Z | |
| date issued | 2014 | |
| identifier other | 6922750.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1035444?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Numerical analysis on MUF process for flip chip packaging | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8161499 | |
| subject keywords | Broadband antennas | |
| subject keywords | Horn antennas | |
| subject keywords | Impedance | |
| subject keywords | Loaded antennas | |
| subject keywords | Metals | |
| subject keywords | UWB | |
| subject keywords | horn antenna | |
| subject keywords | ridge | |
| identifier doi | 10.1109/APCAP.2014.6992577 | |
| journal title | lectronic Packaging Technology (ICEPT), 2014 15th International Conference on | |
| filesize | 1422379 | |
| citations | 0 |
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