Reliable genetic algorithm based intelligent routing for MANET
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: 2014شناسه الکترونیک: 10.1109/ICEPT.2014.6922720
کلیدواژه(گان): elemental semiconductors,integrated circuit design,integrated circuit measurement,low-power electronics,silicon,three-dimensional integrated circuits,2.5D IC silicon interposer design,BW,PI,SI,Si,TSV,WideIO memory interface,electrical performance,logic-to-memory bandwidth,low power application processing device,power consumption,power integrity,signal integrity,smart mobile product,ultramemory capacity,Analytical models,Couplings,Noise,Silicon,Substrates,Through-silicon
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Reliable genetic algorithm based intelligent routing for MANET
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contributor author | Biradar, Arun , Thool, Ravindra C. | |
date accessioned | 2020-03-12T20:58:17Z | |
date available | 2020-03-12T20:58:17Z | |
date issued | 2014 | |
identifier other | 6916649.pdf | |
identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1032363 | |
format | general | |
language | English | |
publisher | IEEE | |
title | Reliable genetic algorithm based intelligent routing for MANET | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8158006 | |
subject keywords | elemental semiconductors | |
subject keywords | integrated circuit design | |
subject keywords | integrated circuit measurement | |
subject keywords | low-power electronics | |
subject keywords | silicon | |
subject keywords | three-dimensional integrated circuits | |
subject keywords | 2.5D IC silicon interposer design | |
subject keywords | BW | |
subject keywords | PI | |
subject keywords | SI | |
subject keywords | Si | |
subject keywords | TSV | |
subject keywords | WideIO memory interface | |
subject keywords | electrical performance | |
subject keywords | logic-to-memory bandwidth | |
subject keywords | low power application processing device | |
subject keywords | power consumption | |
subject keywords | power integrity | |
subject keywords | signal integrity | |
subject keywords | smart mobile product | |
subject keywords | ultramemory capacity | |
subject keywords | Analytical models | |
subject keywords | Couplings | |
subject keywords | Noise | |
subject keywords | Silicon | |
subject keywords | Substrates | |
subject keywords | Through-silicon | |
identifier doi | 10.1109/ICEPT.2014.6922720 | |
journal title | omputer Applications and Information Systems (WCCAIS), 2014 World Congress on | |
filesize | 364162 | |
citations | 0 |