Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration
ناشر:
سال
: 2014شناسه الکترونیک: 10.1109/ICPR.2014.423
کلیدواژه(گان): computational complexity,filtering theory,image matching,stereo image processing,computational complexity,connected weight propagation,full-image guided filtering,stereo matching,Accuracy,Computational complexity,Filtering algorithms,Matched filters,Signal processing algorithms,Stereo vision,eight-connected weight propagation,full-image guided filtering,local stereo matching
کالکشن
:
-
آمار بازدید
Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration
Show full item record
| date accessioned | 2020-03-12T20:43:41Z | |
| date available | 2020-03-12T20:43:41Z | |
| date issued | 2014 | |
| identifier other | 6886154.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1023308 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8148130 | |
| subject keywords | computational complexity | |
| subject keywords | filtering theory | |
| subject keywords | image matching | |
| subject keywords | stereo image processing | |
| subject keywords | computational complexity | |
| subject keywords | connected weight propagation | |
| subject keywords | full-image guided filtering | |
| subject keywords | stereo matching | |
| subject keywords | Accuracy | |
| subject keywords | Computational complexity | |
| subject keywords | Filtering algorithms | |
| subject keywords | Matched filters | |
| subject keywords | Signal processing algorithms | |
| subject keywords | Stereo vision | |
| subject keywords | eight-connected weight propagation | |
| subject keywords | full-image guided filtering | |
| subject keywords | local stereo matching | |
| identifier doi | 10.1109/ICPR.2014.423 | |
| journal title | ow Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on | |
| filesize | 585477 | |
| citations | 0 | |
| contributor rawauthor | Ito, Y. , Fukushima, T. , Lee, K.-W. , Choki, K. , Tanaka, T. , Koyanagi, M. |